Thermal simulation and analysis is an invaluable tool in hardware design and integration, providing critical information about thermal performance of a device (such as temperature distribution across electrical and mechanical...
NVIDIA’s recently announced “Super” update - a software enhancement enabling additional power modes for the Jetson SoCs - is great news for Antmicro’s customers building powerful edge devices with a small footprint using our...
A few years back Antmicro introduced the first DDR5 capable platform to our open source FPGA-based Rowhammer research framework developed in cooperation with Google - the Data Center RDIMM DDR5 Tester. The follow-on SO-DIMM...
The COM Express specification provides an open industry standard for Computer-On-Modules designed for high-end, specialized use cases. In particular, COM Express Type 7 is dedicated for data processing applications that require...
System-in-Packages (SiP) are a way of enclosing multiple integrated circuits into a single component package, often used in space-constrained consumer applications like in wearables or cell phones or miniaturized, environment...
Focus on modularity and component reuse in software and hardware is prevalent at Antmicro as a means to improve vertical integration, and in turn, accelerate prototyping and get customer projects to market faster. In line with...
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